Organic optoelectronic component

ABSTRACT

An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. application Ser. No.16/995,879, filed Aug. 18, 2020, now allowed, which is a continuation ofU.S. application Ser. No. 16/087,306, filed Sep. 21, 2018, now U.S. Pat.No. 10,804,497, which is a national phase entry under 35 U.S.C. § 371 ofInternational Application No. PCT/EP2017/056549, filed Mar. 20, 2017,published as International Publication No. WO 2017/162582 A1, whichclaims priority from German Application No. 10 2016 105 198.5, filedMar. 21, 2016, all of which are incorporated herein by reference.

TECHNICAL FIELD

This disclosure relates to an organic optoelectronic component.

BACKGROUND

In organic optoelectronic components such as organic light-emittingdiodes (OLEDs), only a part of the electromagnetic radiation generatedin the light-emitting layer is coupled out to the surroundings. Theremaining part of the radiation is distributed to various loss channels,for example, in radiation, which is guided in the substrate or inorganic layers by wave guiding effects. Without technical measures, onlyone quarter of the generated radiation is coupled out to thesurroundings, while the remaining radiation is lost due to wave guidingeffects and total re-flection. For manufacturers of such components, itis desirable to keep secret the technical measures used to increase theradiation output and thus the coupling-out technology so that theorganic optoelectronic components cannot be analyzed, copied orfalsified or only with difficulty.

There is thus a need to provide an organic optoelectronic component,which coupling-out technology cannot be analyzed or is hampered and copyprotected.

SUMMARY

We provide an organic optoelectronic component including an organicfunctional layer stack between a first electrode and a second electrodeincluding a light-emitting layer formed to emit a radiation duringoperation of the component, and a coupling-out layer arranged above thefirst electrode and/or the second electrode which is in a beam path ofthe radiation of the light-emitting layer, wherein the coupling-outlayer includes a structured layer and a planarization layer arrangedthereabove and the structured layer has a structured surface structuredat least in places, the planarization layer planarizes the structuredsurface of the structured layer, and a difference in the refractiveindices of the structured layer and the planarization layer is smallerthan 0.3 at least in places.

We also provide an organic optoelectronic component including an organicfunctional layer stack between a first electrode and a second electrodeincluding a light-emitting layer formed to emit radiation duringoperation of the component, a coupling-out layer arranged above thefirst electrode and/or the second electrode which is in a beam path ofthe radiation of the light-emitting layer, and a protective layer abovethe coupling-out layer, wherein the coupling-out layer includes astructured layer and a planarization layer arranged thereabove and thestructured layer has a structured surface structured at least in places,the planarization layer planarizes the structured surface of thestructured layer, the protective layer cannot be removed without atleast partially destroying the coupling-out layer, and adhesion of thestructured layer to the planarization layer is smaller than adhesion ofthe protective layer to the planarization layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A, 2, 3 and 4A show schematic side views of examples of organicoptoelectronic components.

FIG. 1B shows a side view of an example of an organic optoelectroniccomponent during the detachment of the protective layer.

FIG. 4B shows a plan view of an example of an organic optoelectroniccomponent.

DETAILED DESCRIPTION

Our organic optoelectronic component may comprise an organic functionallayer stack. The organic functional layer stack is arranged between afirst electrode and a second electrode. The organic functional layerstack comprises a light-emitting layer formed to emit radiation or lightduring operation of the component. The light-emitting layer ispreferably formed to emit light during operation of the component in thevisible range of the electromagnetic spectrum, for example, white light.

The fact that one layer or one element is arranged “between” two otherlayers or elements, can mean that the one layer or the one element isarranged directly in direct mechanical and/or electrical contact or inindirect contact with one of the two other layers or elements or indirect mechanical and/or electrical contact or in indirect contact withother layers or elements. In indirect contact, further layers and/orelements can then be arranged between the one and at least one of thetwo other layers or between the one and at least one of the two otherelements.

The organic optoelectronic component may comprise a coupling-out layerarranged in the beam path of the radiation of the light-emitting layer.In particular, the coupling-out layer is arranged above the first and/orthe second electrode.

The fact that a layer or an element is arranged or applied “on” or“above” another layer or another element, can mean that the one layer orthe one element is arranged directly in direct mechanical and/orelectrical contact on the other layer or the other element. Furthermore,it can also mean, that the one layer or the one element is arrangedindirectly on or above the other layer or the other element. In thisexample, further layers and/or elements can then be arranged between theone and the other layer or between the one or the other element.

The coupling-out layer may comprise a structured layer and aplanarization layer arranged thereabove or consists of these layers. Thecoupling-out layer increases the coupling-out of radiation generated inthe light-emitting layer or the light generated in the light-emittinglayer.

The structured layer may have a structured surface structured at leastin places, and the planarization layer planarizes the structured surfaceof the structured layer. The fact that the planarization layerplanarizes the structured surface of the structured layer means inparticular that the planarization layer adapts to the surface of thestructured layer. In particular, the planarization layer fills recessesof the surface of the structured layer, which are produced by thestructuring of the surface of the structured layer, without gaps, in aform-fitting and/or complete manner. The coupling-out layer comprisesthe structured layer and the planarization layer arranged thereabove hasin particular a smooth surface. The layer thicknesses of theplanarization layer and the structured layer can thus vary over theirarea in this example, while the layer thickness of the coupling-outlayer is constant or constant within the scope of production conditions.In particular, the planarization layer completely covers the structuredlayer.

The fact that the structured layer has a structured surface structuredat least in places may mean that the surface is structured only inplaces or over the entire surface. For example, the surface of thestructured layer may only be structured laterally, that is to say in aplan view from above onto this layer on the outer sides.

The difference in the refractive indices of the structured layer and ofthe planarization layer may be less than 0.3, preferably less than 0.2,at least in places, particularly preferably less than 0.1. Inparticular, the difference between the refractive indices of thestructured layer and the planarization layer at the places at which theplanarization layer is arranged above the structures of the structuredlayer is less than 0.3, preferably less than 0.2, particularlypreferably less than 0.1. Very particularly preferably, the refractiveindex of the structured layer and of the planarization layer is the sameat least in places. Due to the small differences in the refractiveindices, the structuring of the structured layer is not visible for aviewer from outside the organic optoelectronic component. Since thestructuring of the surface of the structured layer within thecoupling-out layer substantially contributes increasing the coupling-outof light, a viewer cannot recognize the structuring from outside so thatthe coupling-out technology used cannot be detected. A post-constructionof the organic optoelectronic component is thus made more difficult orprevented. In other words, a post-construction can be prevented and thusa kind of copy protection can be achieved.

The organic optoelectronic component may comprise a substrate. Thesubstrate can comprise, for example, one or more materials in the formof a layer, a plate, a film or a laminate selected from quartz, glass,plastic, metal, and silicon wafer. In particular, the substrate containsglass or consists thereof.

The first electrode may be arranged on the substrate, in particular indirect mechanical contact with the substrate. The first electrode is inparticular designed as an anode.

At least one of the electrodes may be transparent. A layer is referredto as transparent, which is permeable to the radiation generated in thelight-emitting layer, in particular for visible light. In this example,the transparent layer can be clearly translucent or at least partiallylight-diffusing or partially light-absorbing so that the transparentlayer can, for example, also be diffusely or milky translucent.Particularly preferably, a layer referred to here as transparent, is aslight-transmissive as possible so that in particular the absorption ofthe radiation generated during operation of the component in thelight-emitting layer of the organic functional layer stack is as low aspossible.

In the organic optoelectronic component, for example, the firstelectrode may be transparent and the second electrode may be formed tobe reflective. The organic optoelectronic component can thus be formedas a bottom emitter. Alternatively, for example, the first electrode maybe formed reflective and the second electrode may be formed transparent.The organic optoelectronic component can thus be formed as a topemitter.

Both electrodes may be transparent. The radiation generated in thelight-emitting layer of the organic functional layer stack can thus betransmitted in both directions that is to say through both electrodes.In the event that the organic optoelectronic component has a substrate,this means that the radiation passes through the substrate, which isthen likewise transparent, and may be radiated into the direction facingaway from the substrate. Furthermore, in this example, all layers of theorganic optoelectronic component may be transparent so that the organicoptoelectronic component forms a transparent organic light-emittingdiode.

In particular, the coupling-out layer is arranged above the electrodewhich is transparent. If the OLED is a transparent OLED, the first andthe second electrode are transparent, the coupling-out layer may beformed over both electrodes. The coupling-out layer is preferablylocated on the main surface of the first and/or second electrode facingaway from the organic layer stack.

The coupling-out layer may be transparent.

A transparent electrically conductive oxide, for example, may be used asa material for a transparent electrode. Transparent electricallyconductive oxides (“TCO” for short) are transparent electricallyconductive materials, generally metal oxides such as, for example, zincoxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indiumtin oxide (ITO). In addition to binary metal-oxygen compounds such as,for example, ZnO, SnO₂ or In₂O₃, also ternary metal-oxygen compoundsbelong to the group of TCOs such as, for example, Zn₂SnO₄, CdSnO₃,ZnSnO₃, MgIn₂O₄, GaInO₃, Zn₂In₂O₅ or In₄Sn₃O₁₂, or mixtures of differenttransparent conductive oxides. Furthermore, it may be possible that theTCOs do not necessarily correspond to a stoichiometric composition andmay also be p- or n-doped.

The material used for a reflecting electrode may be, inter alia, inparticular aluminum, barium, indium, silver, gold, magnesium, calcium,copper or lithium and compounds, combinations and alloys thereof proveto be advantageous. These materials may also be used for transparentelectrodes. The transparency can be adjusted by the layer thickness ofthe electrode. Silver nanowires may also be used for transparentelectrodes.

The organic functional layer stack may be arranged on the firstelectrode. The first electrode may be arranged on a substrate.

The organic functional layer stack has at least one light-emittinglayer. The light-emitting layer may comprise organic polymers, organicoligomers, organic monomers, organic small non-polymeric molecules(“small molecules”) or combinations thereof. Furthermore, thelight-emitting layer can be an electroluminescent layer. Materialshaving a radiation emission on the basis of fluorescence orphosphorescence are suitable as materials for this purpose, for example,polyfluorene, polythiophene or polyphenylene or derivatives, compounds,mixtures or copolymers thereof.

The organic functional layer stack may comprise further functionallayers such as, for example, hole injection layers, hole-blockinglayers, electron-transport layers, electron-blocking layers and/orelectron-injection layers.

The organic optoelectronic component may be formed as an organiclight-emitting diode (OLED).

The organic optoelectronic component may have at least one encapsulationlayer. In this example, an encapsulation layer is a device set up forthe purpose of forming a barrier to atmospheric substances, inparticular moisture and oxygen. In other words, the encapsulation layeris formed such that the encapsulation layer is permeated by atmosphericsubstances such as water or oxygen, at most to very small proportions.

The encapsulation layer may be a thin-film encapsulation layer. Thethin-film encapsulation layer may have one or more thin layers applied,for example, by chemical vapor deposition (CVD) or PECVD (“plasmaenhanced chemical vapor deposition”) and/or an atomic layer depositionmethod (ALD) and, for example, contain one or more materials siliconoxide, silicon carbide, silicon nitride, aluminum oxide, tin oxide,zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide andtantalum oxide. The encapsulation layer may furthermore be a mechanicalprotection in the form of a plastic layer and/or a laminated glass layerand/or laminated metal foil, for example, made of aluminum. In this way,for example, a scratch protection may be achieved.

Alternatively, other encapsulation layers are also possible, forexample, in the form of a glued-on glass cover. In particular, the glasslid or the glass is arranged on a thin-film encapsulation by an adhesiveor an adhesive layer.

With regard to the basic structure of an organic optoelectroniccomponent, for example, with regard to the structure, the layercomposition and the materials are referred to in WO 2010/066245 A1, thesubject matter of which is incorporated herein by reference in relationto the structure, the layer composition and the materials.

The organic optoelectronic component may comprise a protective layerarranged above the coupling-out layer. The protective layer is inparticular transparent.

The planarization layer may be formed from a material having adhesiveproperties, for example, an adhesive.

The protective layer may be irreversibly bonded to the planarizationlayer. This means that the protective layer cannot be removed from thecomponent without destroying the coupling-out layer because theplanarization layer is at least partially, preferably completely,detached as well.

Preferably, adhesion of the planarization layer to the structured layeris lower than adhesion of the planarization layer to the protectivelayer. In other words, the planarization layer adheres more strongly tothe protective layer than to the structured layer.

The protective layer may be irreversibly bonded to the planarizationlayer and the structured layer is reversibly connected to theplanarization layer. This means that the protective layer cannot beremoved from the component without destroying the coupling-out layerbecause the planarization layer is at least partially, preferablycompletely, completely detached too. The structured layer, however, ispreferably not detached and thus remains above the first and/or secondelectrode.

If the protective layer is removed from the outside, the planarizationlayer is also removed at the same time so that the structures of thestructured layer become irreversibly visible. Irreversible means thatthe planarization layer can no longer be applied to the structured layerin a precisely fitting manner or only with difficulty. As a result,after the protective layer has been removed in conjunction with theplanarization layer, the organic optoelectronic component can no longerbe optically examined in a reasonable manner. The emission spectrum ofthe component is changed by the irreversible destruction of thecoupling-out layer compared to the emission spectrum of the component inthe original state. The measurement of the spectrum of the organicoptoelectronic component is thus no longer possible, and thecoupling-out technology can thus be masked. In addition, the technicalbenchmarking of competitors is made more difficult. The combination ofthe coupling-out layer with the protective layer thus forms an easilydetectable copy protection.

The structuring of the structured layer may be carried out periodicallyor non-periodically. The structures may be lens-shaped, that is to saywith convex or concavely curved surfaces, pyramid-shaped, truncatedpyramid-shaped, truncated cone-shaped, rectangular, square or similar.The structures may, for example, be photolithographically producedstructures, microlenses, holographic grating structures or structuresfor generating coherent optical effects. It is also possible for thestructures to be produced by embossing, printing or laser engraving. Theprinting can be effected, for example, by inkjet printing. By thestructuring, the coupling-out of light may be improved, for example, bylight scattering.

The structured layer may have structures, in particular topographicalstructures, having structure sizes of 1 nm to 100 μm, preferably 0.5 μmto 100 μm, particularly preferably 5 to 50 μm. The structure sizes maybe the lateral and/or the vertical extent. The interspaces between thetopographical structures are in particular filled up gap-free, form-fitand/or complete by the planarization layer and the structures and thestructured layer are completely covered by the planarization layer. Thestructures may in particular also differ in their structure sizes, thatis to say structures of different structure sizes may be present.

The coupling-out layer may have a refractive index at least in placesadapted to the refractive index of the functional layers of the organicfunctional layer stack. In particular, the refractive index of thecoupling-out layer and the refractive index of the functional layers ofthe organic functional layer stack may be the same. The maximum possiblelight output can thus be achieved.

The coupling-out layer may have a refractive index of approximately 1.8at least in places. In particular, both the structured layer and theplanarization layer have a refractive index of approximately 1.8 atleast in places, wherein the difference between the refractive indicesof the structured layer and the planarization layer is less than 0.3 atleast in places, preferably less than 0.2 at least in places,particularly preferably less than 0.1 at least in places. Compared to adirect coupling out of the radiation generated in the light-emittinglayer in air having a refractive index of approximately 1, the loss ofradiation may be reduced due to waveguide effects or total reflection atthe interface of the electrode/coupling-out layer compared to theelectrode/air and thus improving the coupling-out of light.

The planarization layer and/or the structured layer and/or theprotective layer may comprise a polymer or consist of a polymer, whereinthe polymer is preferably selected from a group comprising polyimides,polyacrylates, epoxy resins and silicones. For example, it can bepolymethyl methacrylate. The polymers have in particular a refractiveindex of approximately 1.5. The polymers have adhesive properties. Thus,both the structured layer and the protective layer may adhere to theplanarization layer.

The planarization layer and/or structured layer and/or the protectivelayer may comprise nanoparticles, in particular highly refractivenanoparticles. By the nanoparticles, it is possible to increase therefractive index of the layer. For example, the refractive index of theplanarization layer and/or of the structured layer and/or of theprotective layer comprising a polymer and nanoparticles can thus be 1.8.

The nanoparticles may have a size of 1 nm to 100 nm, preferably 5 nm to50 nm.

The nanoparticles, in particular the highly refractive nanoparticles,may be formed from a metal oxide, for example, TiO₂ or ZrO₂.

The planarization layer and the structured layer may comprise the samematerials or consist of the same materials. It can thus be guaranteedthat the refractive index is identical so that the structuring is notvisible from the outside.

The polymers can be applied in liquid form to the structured layer sothat a gap-free, form-fit and/or complete filling of the interspaces ofthe structures of the structured layer may be carried out and can thusbe ensured.

A self-organizing monolayer may be formed between the structured layerand the planarization layer, also called self-assembled monolayer orSAM. The self-organizing monolayer may achieve an adhesion reductionbetween the structured layer and the planarization layer. As a result,for example, if the structured layer and the protective layer comprisethe same material or consist of the same material, the adhesion or bondof the structured layer to the planarization layer is lower than theadhesion or adhesion of the protective layer to the planarization layer.As a result, during removal of the protective layer, the planarizationlayer is also removed at the same time and the coupling-out layer isthus destroyed.

The coupling-out layer may consist of the structured layer, theself-organizing monolayer and the planarization layer.

The self-organizing monolayer may consist of only one molecular layer.Depending on the material used, it may have, for example, a layerthickness of 0.1 nm to 10 nm. The optical properties of the organicoptoelectronic component are thus not influenced or hardly influenced bythis layer.

The self-organizing monolayer may be formed from thiols, silanes,silanols or phosphonates. For example, the self-organizing monolayer isformed from methyltrichlorosilane or methylthiol.

The structured layer may be a substrate, a scattering layer and/or anencapsulation layer. For example, the structured layer is the substrateon which the first electrode is arranged. However, it can also be ascattering layer or an encapsulation layer arranged on the substrate,preferably on the main surface of the substrate facing away from thelayer stack.

If the structured layer is a scattering layer, scattering particles maybe embedded in the structured layer. For example, the scatteringparticles can be SiO₂, TiO₂ or ZrO₂ particles. It is possible that thestructured layer differs from the planarization layer only by thescattering particles. The structured layer may thus comprise a polymer,scattering particles and optionally nanoparticles or consists of thesematerials, and the planarization layer may comprise the same polymer andoptionally the same nanoparticles or consists of these materials.

The encapsulation layer may be a thin-film encapsulation layer, a coverfilm or a lacquer layer. The thin-film encapsulation may be formed asdescribed above and, for example, has silicon oxide, silicon carbide,silicon nitride, aluminum oxide, tin oxide, zirconium oxide, titaniumoxide, hafnium oxide, lanthanum oxide and tantalum oxide.

The cover foil or lacquer layer may comprise the same materials as theplanarization layer. They may therefore comprise a polymer or consist ofa polymer. The polymer is preferably selected from a group comprisingpolyimides, polyacrylates, epoxy resins and silicones.

The structured layer may comprise or consist of quartz, glass orplastic, preferably glass. Glass has a refractive index of approximately1.5, preferably 1.8. For example, the structured layer may compriseglass or consist of glass and the planarization layer may comprise orconsist of polymethyl methacrylate. Glass and polymethyl methacrylatemay have a refractive index of approximately 1.5. Glass having arefractive index of 1.8 may also be selected for the structured layer,and the planarization layer comprises polymethyl methacrylate andnanoparticles, wherein the refractive index of the planarization layermay be increased to 1.8 by the addition of the nanoparticles.

The protective layer may comprise or consist of quartz, glass orplastic. The protective layer may optionally contain scatteringparticles such as TiO₂ and can thus be formed to be light-scattering.

The difference between the refractive indices of the structured layerand of the planarization layer may be equal to or greater than 0.1 atleast in places, preferably greater than 0.2, particularly preferablygreater than 0.3. In particular in conjunction with suitable structuresizes, the structuring of the structured layer may be made visible to aviewer from outside the organic optoelectronic component in places.Thus, for example, letterings can be made visible with themanufacturer's logo. The greater the refractive index difference with agiven structural size of the structures, the more clearly the structurescan be made visible from the outside.

The refractive index of the planarization layer may be determined atleast in places by adding nanoparticles, in particular high-indexnanoparticles. The effective refractive index is obtained from thearithmetic mean of the volume fractions of the individual constituents,if the size of the components/particles is substantially smaller,preferably smaller than 100 nm, than the wavelength.

The planarization layer may comprise nanoparticles, in particular highlyrefractive nanoparticles, at least in places. By the nanoparticles, itis possible to lift the refractive index of the layer in places. Forexample, the refractive index of the planarization layer comprising apolymer and nanoparticles can thus be approximately 1.8 in places. Forexample, the structured layer may comprise glass and has a refractiveindex of 1.5. The planarization layer may be formed in places frompolymethyl methacrylate and therefore has a refractive index of 1.5 atthese places, and comprises at places polymethyl methacrylate andnanoparticles, and thus has a higher refractive index than 1.5, forexample, 1.8, at these places. Structures above which the planarizationlayer is applied having a refractive index of 1.5 are then not visiblefrom the outside, while the structures above which the planarizationlayer is applied having a refractive index of 1.8 are visible from theoutside.

The nanoparticles may have a size of 1 nm to 100 nm, preferably 5 nm to50 nm.

The nanoparticles may be formed from a metal oxide, for example, TiO₂ orZrO₂.

The planarization layer may comprise pores or low-refractivenanoparticles in places. In this example, low-refractive nanoparticlesmean that they have a lower refractive index than the polymer used forthe planarization layer. As a result, it is possible to reduce therefractive index of the layer in places.

The planarization layer may comprise pores or low-refractivenanoparticles in places. In this example, low-refractive nanoparticlesmean that they have a lower refractive index than the polymer used forthe planarization layer. As a result, it is possible to reduce therefractive index of the layer in places.

The planarization layer may be arranged only in the middle or laterally,having a difference in the refractive indices from the structured layerwhich is greater than 0.1, preferably greater than 0.2, and particularlypreferably greater than 0.3. A lateral arrangement means that in a planview from above, the planarization layer is arranged, for example, on anouter side of the surface, having a difference in the refractive indicesto the structured layer greater than 0.1, preferably greater than 0.2,particularly preferably greater than 0.3. It is thus possible to make astructuring of the structured layer visible to a viewer from outside theorganic optoelectronic component in the plan view in the center or on atleast one outer side.

Further advantages and developments emerge from the examples describedbelow in conjunction with the figures.

Identical, similar or identically acting elements are provided with thesame reference numerals in the figures. The figures and the size ratiosof the elements illustrated in the figures relative to one another arenot to be regarded as being to scale. Rather, individual elements, inparticular layer thicknesses, may be illustrated on an exaggeratedlylarge scale for greater ease of depiction and/or better comprehension.

FIG. 1A shows a schematic side view of an example of an organicoptoelectronic component. The organic optoelectronic component comprisesa layer sequence S arranged between a first electrode 1 and a secondelectrode 2. The layer sequence S comprises a light-emitting layer (notshown) that emits electromagnetic radiation in the visible region of theelectromagnetic spectrum during operation of the component. The firstelectrode 1 is formed to be reflective and consists, for example, ofaluminum, and the second electrode 2 is transparent and consists of ITO.The optoelectronic component is formed as a top emitter. The firstelectrode 1 may be arranged on a substrate (not shown here). Acoupling-out layer 3 is arranged above the second electrode 2. Thecoupling-out layer 3 is transparent to the radiation generated in thelight-emitting layer and consists of a structured layer 3 a and aplanarization layer 3 b. The structured layer 3 a has a structuredsurface A. The structured layer 3 a has structures 5 with structuresizes of 1 nm to 100 μm. The structures may have, for example, a lateralextent of 50 nm and a vertical extent, that is to say a height of 1 μm.The structured layer 3 a consists of glass with a refractive index ofabout 1.8. The planarization layer 3 b is arranged above the structuredlayer 3 a. The planarization layer 3 b covers the structured layer 3 acompletely or over the entire surface, in particular, the planarizationlayer 3 b fills interspaces between the structures 5 gap-free, form-fitand completely. The planarization layer 3 b is formed from polymethylmethacrylate and nanoparticles and has a refractive index ofapproximately 1.8. The structures 5 are thus not visible to a viewerfrom outside the organic optoelectronic component. Thus, the structureof the coupling-out layer 3 cannot be detected from the outside. Apost-construction of the organic optoelectronic component is thus mademore difficult or prevented. A protective layer 4 is arranged above thecoupling-out layer 3. The coupling-out layer 3 and the protective layer4 are located in the beam path R of the radiation generated by thelight-emitting layer in the organic functional layer stack S. Theprotective layer 4 may be, for example, a thin-film encapsulation layermade of silicon nitride. The protective layer 4 is irreversibly bondedto the planarization layer 3 b, while the structured layer 3 a isreversibly connected to the planarization layer 3 b. The adhesion of theplanarization layer 3 b to the structured layer 3 a is thus lower thanthe adhesion of the planarization layer 3 b to the protective layer 4.If the protective layer 4 is removed, as illustrated in FIG. 1B, theplanarization layer 3 b is also removed at the same time so that thestructures 5 of the structured layer 3 a become irreversibly visible.After detachment, the planarization layer 3 b can no longer be appliedto the structured layer 3 a in a precisely fitting manner or only withdifficulty. As a result, after the protective layer 4 has been removedin conjunction with the planarization layer 3 b, the organicoptoelectronic component can no longer be optically examined in areasonable manner. The emission spectrum of the component is altered bythe irreversible destruction of the coupling-out layer 3 compared to theemission spectrum of the component in the original state, as illustratedin FIG. 1A. Measurement of the spectrum of the organic optoelectroniccomponent is thus no longer possible, and the coupling-out technologymay be masked. The combination of the coupling-out layer 3 with theprotective layer 4 thus forms an easily detectable copy protection.

FIG. 2 shows a schematic side view of an example of an organicoptoelectronic component. Compared to the optoelectronic component inFIG. 1A, the optoelectronic component in FIG. 2 is a bottom emitter. Inthis example, the coupling-out layer 3 is arranged above the firstelectrode 1, in particular over the main surface of the first electrode1 facing away from the organic functional layer stack S. The firstelectrode 1 may be formed as an anode and may consist of ITO. Thestructured layer 3 a is the substrate above which the first electrode 1is arranged and consists, for example, of glass. The second electrode 2is formed as a cathode and being reflective and consists, for example,of silver. The coupling-out layer 3 and the protective layer 4 areconstructed as described in FIG. 1A.

FIG. 3 shows a schematic side view of an example of an optoelectroniccomponent. The optoelectronic component is formed as a transparent OLED.This means that the radiation is emitted to the surroundings via thefirst electrode 1 and via the second electrode 2. Compared to FIGS. 1Aand 2, the coupling-out layer 3 and the protective layer 4 are locatedabove the first electrode 1 and above the second electrode 2. The twoelectrodes 1 and 2 are formed to be transparent.

FIG. 4A shows a schematic side view of an organic optoelectroniccomponent. Compared to the component of FIG. 1A, the difference betweenthe refractive indices of the structured layer 3 a and the planarizationlayer 3 b is equal to or greater than 0.1 in places, preferably greaterthan 0.2, particularly preferably greater than 0.3. In the illustration,the hatched region of the planarization layer 3 b has a refractive indexwhich is at least 0.1 different than the structured layer 3 a. Forexample, the structured layer 3 a comprises a glass having a refractiveindex of 1.5. The planarization layer 3 b consists of polymethylmethacrylate having a refractive index of 1.5 and in the hatched regionof polymethyl methacrylate and nanoparticles having a refractive indexof 1.8. The structuring in the hatched region can thus be made visibleto a viewer from outside the organic optoelectronic component. This isillustrated in FIG. 4B that shows a plan view from above onto anoptoelectronic component, in particular onto the protective layer 4, andin which a lettering is visible in the center.

The description made with reference to examples does not restrict ourcomponents and methods to the examples. Rather, this disclosureencompasses any novel feature and any combination of features, includingin particular any combination of features in the appended claims, evenif the feature or combination is not itself explicitly indicated in theclaims or examples.

REFERENCE SIGN LIST

-   1 first electrode-   2 second electrode-   3 coupling-out layer-   3 a structured layer-   3 b planarization layer-   4 protective layer-   5 structure-   A structured surface-   S organic layer stack-   R beam path

1. (canceled)
 2. An organic optoelectronic component comprising: anorganic functional layer stack between a first electrode and a secondelectrode comprising a light-emitting layer formed to emit radiationduring operation of the component; a coupling-out layer arranged abovethe first electrode and/or the second electrode, which is in a beam pathof the radiation of the light-emitting layer; and a protective layerabove the coupling-out layer, wherein the protective layer cannot beremoved without at least partially destroying the coupling-out layer. 3.The organic optoelectronic component according to claim 2, wherein thecoupling-out layer comprises a structured layer and a planarizationlayer arranged thereabove and the structured layer has a structuredsurface structured at least in places, and wherein the planarizationlayer planarizes the structured surface of the structured layer.
 4. Theorganic optoelectronic component according to claim 3, wherein thestructured layer has structures not visible at least in places for aviewer from outside the organic optoelectronic component.
 5. The organicoptoelectronic component according to claim 3, wherein the structuredlayer has structures that have a size of 1 Nanometer to 100 Micrometer.6. The organic optoelectronic component according to claim 3, whereinthe structuring is periodic or non-periodic.
 7. The organicoptoelectronic component according to claim 3, wherein the planarizationlayer comprises a polymer and the polymer is selected from the groupconsisting of polyimides, polyacrylates, epoxy resins and silicones. 8.The organic optoelectronic component according to claim 3, wherein theplanarization layer comprises nanoparticles of a metal oxide at least inplaces.
 9. The organic optoelectronic component according to claim 3,wherein the structured layer is a substrate, a scattering layer or anencapsulation layer.
 10. The organic optoelectronic component accordingto claim 3, wherein the structured layer comprises glass.
 11. Theorganic optoelectronic component according to claim 3, wherein aselforganizing monolayer is arranged between the structured layer andthe planarization layer.
 12. The organic optoelectronic componentaccording to claim 11, wherein the selforganizing monolayer is formedfrom thiols, silanes, silanols or phosphonates.
 13. The organicoptoelectronic component according to claim 3, wherein the planarizationlayer is formed from a material having adhesive properties.
 14. Theorganic optoelectronic component according to claim 3, wherein theplanarization layer and the structured layer comprise the samematerials.